9MB Electrode for Semiconductor Coating

Product Description

In the field of semiconductor coating, the plasma-sprayed 9MB electrode is an outstanding product with exceptional performance.

From a material composition perspective, the 9MB electrode uses precision back-casting technology to perfectly combine tungsten and copper materials. Tungsten's high melting point and hardness ensure that the electrode maintains a stable structure in the high-temperature environment of semiconductor coating, preventing deformation or damage. Copper's excellent conductivity provides efficient electrical energy transmission, allowing the energy to be quickly and effectively converted into heat during the coating process. This combination of materials offers the dual advantages of high strength and high conductivity, with seamless welding between the two alloys, ensuring uniformity and stability in the overall performance of the electrode.

In terms of performance, the 9MB electrode stands out for its stability and durability. During semiconductor coating processes, whether its chemical vapor deposition (CVD) or physical vapor deposition (PVD), in various complex reaction environments such as high temperatures, high vacuum, or special chemical gas atmospheres, the 9MB electrode consistently maintains a stable working state. Its stable performance ensures uniform coating, allowing the thickness and composition of the coating on the semiconductor wafer's surface to meet precise design requirements, which is crucial for manufacturing high-performance semiconductor devices.

The high electrical conductivity of the electrode provides strong support for coating efficiency and quality. In plasma spraying, the 9MB electrode can quickly convert electrical energy into heat, causing the sprayed material to rapidly melt and be evenly applied to the semiconductor wafer surface. This efficient energy conversion not only speeds up the coating process but also ensures consistent energy output during long coating operations, maintaining coating quality consistency.

The 9MB electrode also offers broad compatibility. It can be adapted to plasma spray equipment from well-known brands like Metco, GTV, FST, and others, and is compatible with spray guns such as F4, 9M, and SG***0. This allows the 9MB electrode to be easily integrated into existing equipment systems in semiconductor manufacturing enterprises of various scales, without the need for extensive modifications to the equipment.

Additionally, the manufacturing process of the 9MB electrode ensures high-precision dimensional specifications. This precision facilitates easy installation and debugging in semiconductor coating equipment, and due to its accurate size, it can be used directly without the need for additional adjustments, greatly improving production efficiency.

In summary, the plasma-sprayed 9MB electrode, with its unique material composition, stable performance, broad compatibility, and high-precision manufacturing process, is a reliable and high-quality electrode product in the semiconductor coating field.