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Amaoe A18 Middle Layer Reballing Stencil For iPhone 16 Series

FOB Price

Get Latest Price

1.5 ~ 5 USD / Piece ( Negotiable )

1 Minimum Order

Country:

Taiwan

Model No:

FOB Price:

1.5 ~ 5 USD / Piece ( Negotiable )(Negotiable) Get Latest Price

Place of Origin:

Price for Minimum Order:

1.5 per Piece

Minimum Order Quantity:

Packaging Detail:

carbon

Delivery Time:

5-7days

Supplying Ability:

100 Piece per Year

Payment Type:

Product Group :

Reballing Stencil

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Shenzhen ASAPFIX technology Co.,Ltd,

Taiwan

Free Member

Contact Person Phonefix

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Product Description

Amaoe IP*6 A*8 BGA Reballing Stencil for iPhone *6/*6 Plus/*6 Pro/*6 Pro Max motherboard CPU/font/audio/power IC /USB control IC and iPhone *6 middle layer soldering repairs. High quality BGA reballing stencil comprehensive steel mesh for iPhone *6/*6 Pro Max middle layer frame/motherboard chip soldering.

Option:
1. Amaoe IP*6 A*8 Reballing Stencil (test version): comprehensive reballing stencil for iPhone *6/*6 Plus/*6 Pro/*6 Pro Max.
2. Amaoe IP*6 PL***2 reballing stencil (test version): for iPhone *6/*6 Plus middle layer frame soldering.
3. Amaoe IP*6 reballing stencil (test version): for iPhone *6 Pro/*6 Pro Max middle layer frame soldering.
Please note that the iPhone *6 series reballing stencil is currently only a test version and will be modified based on the actual motherboard situation.

Country:	Taiwan
Model No:	-
FOB Price:	1.5 ~ 5 / Piece ( Negotiable ) (Negotiable) Get Latest Price
Place of Origin:	CN
Price for Minimum Order:	1.5 per Piece
Minimum Order Quantity:	1
Packaging Detail:	carbon
Delivery Time:	5-7days
Supplying Ability:	100 Piece per Year
Payment Type:	-
Product Group :	Reballing Stencil