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Au-Au Bonding Hollow Cu Package Substrate Manufacturer Quartz Tuning Fork Gyro
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Au-Au Bonding Hollow Cu Package Substrate Manufacturer Quartz Tuning Fork Gyro

FOB Price

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( Negotiable )

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1000 Piece Minimum Order

Country:

China

Model No:

-

FOB Price:

( Negotiable ) Get Latest Price

Place of Origin:

-

Price for Minimum Order:

-

Minimum Order Quantity:

1000 Piece

Packaging Detail:

-

Delivery Time:

-

Supplying Ability:

-

Payment Type:

T/T

Product Group :

-

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Contact Person homraytech

suli, Suzhou, Jiangsu

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Product Specification

Product Description

Au-Au Bonding Hollow Cu Package Substrate Manufacturer Quartz Tuning Fork Gyro
As the professional Quartz Tuning Fork Gyroscope Copper/Cu Clad Support Substrate/Circuit Board Manufacturers and Suppliers, We Use Flip-chip Au-Au Process to Bonding Hollow Copper Clad CCL Support Substrate with Quartz Tuning Fork Gyro Welding Pad. We can customize *0 um Pitch Cu Clad Foil Package Circuit Board/TAB Package Copper Clad Bearing Substrate for various MEMS applications including Quartz Tuning Fork Gyroscope,Piezoelectric, Gimbal,Gyroscope etc.
 

Country: China
Model No: -
FOB Price: ( Negotiable ) Get Latest Price
Place of Origin: -
Price for Minimum Order: -
Minimum Order Quantity: 1000 Piece
Packaging Detail: -
Delivery Time: -
Supplying Ability: -
Payment Type: T/T
Product Group : -

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homraytech < Homray Micron Technology >

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