Automatic bga rework station DH-A5 for big mother board

Product Description

Ⅰ. Function/Features:

1. Optical alignment, accurate chip placement and alignment, completely avoiding misalignment and offset;

2. Automatic disassembly, automatic welding, automatic recovery of chips, completely liberating workers;

3. The breeze adjustment function, adjust different wind speeds according to the size of the chip, rework is

more efficient, and the rework of the large chip is better;

4. Laser positioning, place the motherboard in one step;

5. The preheating zone adopts infrared light-emitting tube, which has fast heating, stably constant

temperature, environmental protection and energy saving, and beautiful appearance;

6. External temperature measurement interfaces, convenient for temperature detection at any time,

temperature control is more accurate and reliable;

7. Touch screen operation, preset program, which can be used proficiently without professional technical

training, making chip repair very easy;

8. Manual and automatic operation modes, debugging or batch repairing are more convenient and simple;

9. An external USB interface is used for software updates and various repair data to be imported into the

computer for analysis and storage;

*0. The large preheating temperature zone can satisfy the rework of the large motherboard of **0***0mm.

*1.Suitable for repairing a variety of SMD devices(POP,SOP,SOJ,QFP,QFN,BGA,PLCC,SCP.....)



Ⅱ. Product parameter

Power Supply: AC**0V±*0％ *0/*0Hz

Total Power: ***0W

Top heater: ***0W

Bottom heater: ***0W

IR preheating area: ***0W (Germany heating tube, heating area of **0 ***5mm)

Operation mod: Fully automatically disassemble,suction,mounting and soldering

Densions: L***0×W***0×H**0 mm

Basic configuration:

  Automatic feeding delivery system+HD digital

  camera+Japanese Misumi suction rod system+Panasonic CCD

  optical counterpoint system+HD digital display PC +upper

  computer+Panasonic servo+Panasonic PLC+an *-inch digital

  touchscreen +Grinding level guide rail(Taiwan Hiwin)+Dalian

Institute of Technology: **-channel temperature control

  system+ American Omega Temperature measurement

  system+High fever efficiency and heating tube+ Resistance to

  ***0 degree black crystal sand glass

Chip feeding system: Automatic receiving, feeding, automatic induction (optional)

Temperature profile storage: ****0 groups

Optical CCD lens:

   Automatic stretch out and go back, which can be moved freely

   before and after the rocker, to eliminate the "observation dead

   corner" problem

IR preheating area: **0×**5mm

Chip angel adjust:

   Φ Angle can be **0° rotation, precision fine tuning fitting suction nozzle

PCBA Positioning: Up and down intelligent positioning,bottom "*-point support"

    with V-groove fixed PCB which can be adjusted freely in theX-axis direction, with

     universal fixtures meanwhile

BGA position: Laser positioning to quickly find the vertical point of the upper

    and lower temperature zone and the central point of BGA

Temperature control: K-type Sensor,Closed loop and 8~*0 segments for temperature

   controlling program

Temperature accuracy:  ±1 ℃

Placement Accuracy:  +/*0.*1mm

CCD system:  A CCD HD digital camera, 2 million pixels, automatic optical

   zoom, laser positioning

Pressure sensor: Inductive pressure greater than ****0g (set up) will initiate

     collision pressure protection

     Safety guard pressure sensor + infrared sensor. Double guard.

     Workbench fine-tuning Back/front±*5mm,left/right±*5mm

PCB size:  Max **0×**0 mm Min *0×*0 mm

PCB thickness:  0.***5mm

BGA chip:  2×****0×**0mm

Gas source Built-in vacuum pump, no external gas source

BGA suction mode:  Negative pressure vacuum suction, automatic induction release

    in place

BGA weight:  ****0g (special specification customization)

Minimum chip spacing:  0.*5mm

External Temperature Sensor:  5 pcs（optional)

Machine type:  Desktop table (optional)

Net weight:  **0kg