Ceramic Base LTCC Thick Film Hybrid Integrated Circuit HIC

Product Description

 Hybrid thick film integrated technology can offer multi-layer and fine line circuits with minimal size and optimal layout which enhance high frequency characteristics. It can also be used for high power modules using stainless steel and Al2O3/AlN substrate.

Furthermore, laser trimming enables producing resistor, inductor and capacitor networks with arbitrary value. The wire bonding and the substrate characteristics result in the circuits with high anti-flushing and anti-vibration quality, strong adhesion, reducing connection and high reliability. 

Be your favourite partner in LTCC (Low Temperature Co-fired Ceramic) with a special focus on RF and microwave applications. Comprehensive support in fields like mobile communications, wireless, automotive, sensor technology, space and various consumer products is given to our customers. We offers the full chain of services around multilayer LTCC comprising consulting, module development, and sample production. The transition to manufacturing is supported due to long-term cooperations with material suppliers and foundry services. Accurate in-house design and modelling tools complete our capabilities.

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