copper clad laminated sheet (alccl frccl)

Product Description

AL base thermal conductive CCL provides the advantages of high thermal conductivity, Excellent solder heat endurance, Excellent Breakdown Voltage, reliability, Thermal conductivity is about five-ten times higher than the FR*4, PCB produced by the subtract can transfer heat, which is electronic components generate, throughing the substrate structure rapid conduct to the back-end cooling base or other cooling modules. Aluminum Copper Clad Laminate Sheet is a sandwich structure, which includes layers of conductor, insulator and metal base. In general, this insulator is made of epoxy resin and high thermal Conductivity filler. The products have been through a number of demanding for a long time environmental testing, access to international certification. 
The Thermal conductivity is 1.**3.0W/M. K, It can fit the demand of high end and MID-range products, with high cost performance. All products pass RoHS standard, have good property and meet low-carbon environmental trend.