eMMC test socket, size 11.5x13_0.5mm,Clamshell structure, for BGA 153 and BGA

Product Description

Material and Finish
1.Socket lid:PEI;
2.Socket Base:PEI;
3.Contacts:BeCu,Selevitve Au-Au Flash over Ni Plating;
4.Springs:Stainless Steel,Passivated;

2.Performance
1.Insulation Resistance:***0M ohm or more at DC **0V;
2.Dielectric withstanding Coltage:**0V AC for One minute;
3.Contact Resistance *0 mohm,Max at *0mA and *0mV Max(Initial);
4.Operation Temperature:**0C- ***0C
5.Contact Force:****0g Per Pin(Normal);
6.Life Span ****0 Times(Mechanical)
7 Operation Force: 3.0KG Max


We are manufactory and localed in Dongguan