FOG/FOB bonding machine XCM71 - A5

FOG/FOB bonding machine  XCM**-A5   

1 About the definition of FOG/FOB bonding machine XCM*1 -A5
2 About the FOG/FOB bonding machine XCM*1 -A5's alternative name
3 About the classification of FOG/FOB bonding  machine  XCM*1 - A5
4 About the application field of  FOG/FOB bonding  machine XCM*1 -  A5
5 About the working principle of FOG/FOB bonding  machine XCM*1 - A5
6 About the FOG/FOB bonding  machine XCM*1  -  A5's competitive advantage
7 About the basic parameters of  FOG/FOB bonding machine  XCM*1 -A5
8 About the functions and characteristics of the FOG/FOB bonding machine  XCM*1 - A5

1、The definition of FOG/FOB bonding machine XCM**-A5:

FOG/FOB bonding machine hereinafter referred to as "state machine" "hot press," using  the  heating of hair heat pipe and the pulse source which mainly be used in the process of LCD module production and maintenance of FPC, COF TAB ,and attached with a TAB with LCD and PCB after using  ACF combination bonding . Using the pressure head,, the temperature of  pressure head,  bonding time, optical alignment system will  let the ACF glue dependend curing conductive FPC with LCD and PCB  .

2、The alternative name of FOG/FOB bonding machine XCM*1 - A5

According to the FOG/FOB bonding  machine and in order to promotion and application,they have many kinds of key names : for example, the upper and lower pulse bonding machines, the pulse bonding machines, semi-automatic bonding machines, automatic bonding machines, single-position bonding machine, pulse up and down hot pressing machine，the pulse hot pressing machine, semi-automatic hot pressing machine, automatic hot pressing machines, single-position hot pressing machine, up down pulse hot pressing bonding machines,up pulse hot pressing bonding machine, semi-automatic hot pressing bonding machine, automatic hot pressing bonding machines, single-position hot pressing bonding machines, single-position pulse bonding machines, single-position pulse pressing machine, FOG up down pulse bonding machines, FOG the pulse bonding machines, FOG semi-automatic bonding machine, FOG automatic bonding machines, single-position FOG bonding machines, FOG up down pulse hot pressing machine，, OGS up and down pulse bonding machines,OGS up pulse bonding machines, OGS semi-automatic bonding machine, OGS automatic bonding machines, single -position OGS bonding machines, OGS up down pulse hot pressing machine,  OGS up pulse pressing machine, OGS semi-automatic hot pressing machine, OGS automatic hot pressing machine,OGS single-position hot pressing machine   , OGS up down pulse hot pressing bonding machines, OGS up pulse hot pressing bonding machines, OGS semi-automatic hot pressing bonding machine, OGS automatic hot pressing bonding machines, OGS single-position hot pressing bonding machines, OGS single-position pulse bonding machines, OGS single -position pulse hot pressing machine，FOB up and down pulse bonding machines, FOB up pulse bonding machines , FOB semi-automatic bonding machines, FOB automatic bonding machines, single-position FOB bonding machines, FOB up and down pulse hot pressing machine,  FOB up pulse hot pressing machine , FOB Semi-automatic hot pressing machine, FOB automatic hot pressing machine, single-position FOB hot pressing machine , FOB up and down pulse hot pressing bonding machines,FOB up hot pulse hot pressing  bonding machines, FOB semi-automatic hot pressing bonding machine, FOB automatic hot pressure bonding machines, single-position  FOB hot pressing bonding machines, single-position  FOB pulse hot pressing  bonding machines, single-position  FOB pulse hot pressing machine, FOB / TAB bonding machines, FOB / TAB bonding equipment,FOG up and down pulse bonding equipment  ,  FOG up pulse bonding equipment, FOG semi-automatic bonding equipment, FOG automatic bonding equipment, single-position FOG bonding equipment, FOG up down pulse hot pressing equipment, FOG up pulse hot pressing equipment , FOG Semi-automatic hot pressing equipment, FOG automatic hot pressing equipment,  FOG single-position hot pressing equipment, FOG up down pulse hot pressing  bonding equipment,FOG up pulse hot pressing  bonding equipment FOG semi-automatic hot pressing bonding equipment, FOG automatic hot pressure bonding equipment, move around the platform hot pressing machine, the platform and move around hot pressing bonding machine,move around the platform bonding equipment , move around the platform hot  pressing equipment.
3、About the classification ofFOG/FOB bonding machine  XCM*1 - A5

1, Classified according to  function 
1.1 thermostat FOG / FOB bonding equipment
1.2 Pulse FOG / FOB bonding equipment
2, Classified according to degree of automation :
2.1 Manual alignment FOG / FOB bonding equipment
2.2 Automatic positioning FOG / FOB bonding equipment
2.3 Automatic FOG / FOB bonding equipment
3, Classified according to the design dimension :
3.1   *7 inches FOG / FOB bonding equipment
3. 2   *1 inch FOG / FOB bonding equipment
3.3   *6 inches FOG / FOB bonding equipment
4.Classified according to the work way of the stage :
4.1 Fixed stage FOG / FOB bonding equipment 
4.2 X-axis stage moves FOG / FOB bonding equipment 
4.3 X-Y-axis stage moves FOG / FOB bonding equipment 
5, Classified according to the driving mode : 
5.1 stepper drive FOG / FOB bonding equipment 
5.2 servo drive FOG / FOB bonding equipment

4、 About the application field of  FOG/FOB bonding machine XCM*1 -  A5 

FOG / FOB bonding equipment is widely used in a variety of LCD and the large size of display panel's production and maintenance; such as: television (TV), laptop computers (NOTE BOOK), liquid crystal display (MONITOR), Tablet PC (PAD ), LCD / LCM production enterprises. 

5、About the working principle of FOG/FOB bonding machine XCM*1 - A5

Working principle of FOG / FOB bonding equipment XCM**-A5 is to use the  head pressure, pressure head temperature,Optical alignment system will make ACF as bonding glue and fixed between the FPC LCD and PCB after curing conductive connection.
6、 About the FOG/FOB bonding machine XCM*1  -  A6's competitive advantage 

6.1  Patent  of sunsom(Patent No. ZL ***********2.2): SUNSOM pressure system cylinder head structure can eliminate dead weight, pressure, minimum accuracy up to 0.1KG 
6.2 Pressure head downward structure part USES the level 3 circuit control, according to quantitative production, manual production, production debugging needs to choose different control methods, has solved the past  problem due to the different work mode press head downward inconvenience control .
6.3 Stepper, servo memory function and Automatically position the same amount of production equipments function used on the equipment subtly on the device solves any inconvenience  caused by  the big flat repeatedly move.
6.4 Own the qualification of equipment manufacturing enterprise in china which has a maximum size of flat panel display of FPD  

7、About the basic parameters of FOG/FOB bonding machine XCM*1 -A5

Input Power: AC**0V ****0Hz 
Working pressure :0.**0 .8 Mpa 
Operating modes: *-inch HMI 
Dimensions: L***0 × W***0 × H***0 mm 
The method of Heating: heating or pulse heating thermostat 
The quantity of Fixture: 2 group X-Y-θ micrometer adjustable 
Range of Temperature : RT***0 ℃ 
Control program: PLC controller 
Body main material: Steel + baking varnish
The thermocouple: K type

8、About the functions and characteristics of the FOG/FOB bonding machine XCM*1 - A5 

8.1use pneumatic components of  Japan SMC and high-precision the moving parts 
8.2 use  temperature controller of Japan and The  function module of the integral PID self-tuning temperature,accurate temperature.
8.3 Imported PLC control:the operation of *-inch full-color touch-screen 
8.4SUNSOM the elimination structure of double-cylinder deadweight, accurate pressure.