fr4 copper clad laminatefr4 copper clad laminateteflon sheet roll

CCL (CCL) for the printed circuit board (PCB) of the main material, an average of 20 ~ 50% PCB cost of raw materials, consists of reinforcing the strength of fiberglass cloth and epoxy resin insulation plus copper from copper substrates.
      Technical development CCL functional requirements from the electronics market toward compact size, high reliability, multi Outsider, green technology and high throughput rate trend. Containing a high density interconnect (HDI), high layer count boards (HLC), IC carrier board and high-reliability applications such as automotive panels on computers, mobile phones, and other consumer electronics products, high functional green base with a strong growth potential, will be the focus of future development PCB products.


CCL (CCL) for the printed circuit board (PCB) of the main material, an average of 20 ~ 50% PCB cost of raw materials, consists of reinforcing the strength of fiberglass cloth and epoxy resin insulation plus copper from copper substrates.
      Technical development CCL functional requirements from the electronics market toward compact size, high reliability, multi Outsider, green technology and high throughput rate trend. Containing a high density interconnect (HDI), high layer count boards (HLC), IC carrier board and high-reliability applications such as automotive panels on computers, mobile phones, and other consumer electronics products, high functional green base with a strong growth potential, will be the focus of future development PCB products.
 

FR4 Copper Clad Laminate Sheet 
1.Spe : FR-1 ,FR-4 ,CEM-1 ,CEM-3

2.Thickness:0.6,0.8,1.0,1.2,1.6,2.0mm. 
3.Width :more than 7~9.9cm ,10~14.9cm ,15cm up ,with different prices.

4.Copper thickness : single/double sides

    (H/H, H/0, 0/0, 1/1, 1/H)

5.Length : 30~120cm