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BIWIN

China

Free Member

Contact Person Helen

Shenzhen, Guangdong

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Product Specification

Product Description

-High and Low Temperature Storage
-High and Low Temperature Operation
-High and Low Temperature Cycling
-ESD Testing 
-Vibration and Shock Testing
-Room Temperature Aging Testing
-Power Failure Testing

Wafer Packaging Service:

-First *2" Wafer Packaging Factory in South China
-Include IC Design, Packaging, Testing, Assembling
-Wafer Packaging Products:TSOP *8, QFN, QFP, BGA, LGA, eMMC, UDP.

Country: China
Model No: -
FOB Price: Get Latest Price
Place of Origin: -
Price for Minimum Order: -
Minimum Order Quantity: -
Packaging Detail: -
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Helen < BIWIN >

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