HDI 1-30 layer high difficult pcb with BGA

Product Description

Surface: Surface Treatment:Tin lead /Leadfree HASL;Flash Gold;ENIG;OSP;Immersion Tin / Silver;Hard Gold; Selective Surface Treatment:ENIG+OSP;ENIG+Gold Finger;Flash Gold+HASL;Flash Gold+Gold Finger;Immersion Silver+Gold Finger;Immersion Tin+Gold Finger Capacity: Layer Count:***6 Layer (*4 Layers needs Review; Bow and Twist :%0.7(%0.5needs Process Review; Min finished size :*0mm**0mm Max finished Size (4L):*2.5Inch **3.5 Inch(Needs Review If length exceeds *0 Inch) Max finished Size (6L):*2.5Inch**6.5Inch(Needs Review If length exceeds *2.5 Inch) Multi-press for Blind/Buried Vias:Multi-press Cycle;3 times(Needs review for 2 cycles pressing) Max finished Size (Double Sides):*3Inch**5Inch(Needs Review If length exceeds *0 Inch) Finished Board Thickness: 0.*0mm*7.0mm(0.2mm Needs Review),0.4mm for HASL Finished Board Thickness Tolerance(1.0mm):±0.1mm Finished Board Thickness Tolerance(>1.0mm):Material Thickness±*0%mm Unspecified Finished Board Thickness Tolerance; No stack up requirements):Multilayer;2.0mm can±0.1mm;2.**3.0mm can±0.*5mm;3.0mm can±0.2mm;Double Sides+/**0%m Reliable Test: Peel Strength:7.8 N/cm Flammability:*4V*0 Ionic Contamination:1 ug/cm2 Min Dielectric Thickness:0.**5mm(only for HOZ Base Copper) / 1OZ if copper ground area >*0% Impedance Tolerance:±5;(<*0;),±*0%(5;*0);±5%;Needs Review; Base Material Type: Material Type: High Tg Material***-Shengyi Tg>**0; Impedance Control Material: Others need Review ***-FR*4,FR*4 HighTg Series RCC Material: Needs Review***-Copper foil thickness *2um,Dielectric Thickness *5,*0,**0um (After Pressing *5,*0,*0um) Prepreg Type: FR*4 Prepreg;LD****0;HDI;:***8 ***6 ***0 ***3 **6 Copper foil: Copper Foil:*2UM;*8UM;*5UM;*0UM;**5UM;Use *0UM base copper;After plating **5UM; Interlayer & Outer layer Image Transfer: Machine: Scrubbing Machine:0.***3.2mm,min 9*9inch