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Heat conduction material thick  copper HDI
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Heat conduction material thick copper HDI

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Contact Person Derek

Huiyang area OK Cheng Technology Park, Huizhou, Guangdong

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Product Specification

  • Brand Name: Heat conduction material thick copper HDI
  • Number of Layers: 6-Layer
  • Base Material: FR4
  • Copper Thickness: 5OZ
  • Board Thickness: 2MM
  • Min. Hole Size: 0.3mm
  • Min. Line Width: 0.05mm
  • Min. Line Spacing: 0.05mm

Product Description

1. National torch project key high tech enterprise
2. Innovative Enterprise of Guangdong Province
3. Provincial Engineering R&D and technology center
4. Top **0 global PCB manufacturing enterprises; CPCA Vicedirector Unit; One of the industry standard formulation Units
5. Global Top1 market share of VGA card
6. Max layer count- *8L(Line width/distance:0.*5mm,Min hole diameter:0.*5mm)
7. Won **1 authorized patents in PCB industry, including *2 for invention,*8 for utility models and 1 for appearance. 

Country: China
Model No: -
FOB Price: ( Negotiable ) Get Latest Price
Place of Origin: -
Price for Minimum Order: -
Minimum Order Quantity: -
Packaging Detail: -
Delivery Time: -
Supplying Ability: -
Payment Type: T/T
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Related Products Victory Giant Technology(Huizhou) Co., Ltd

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