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heatsink compound paste for computer cpu X23-7783D-2g-Tube mini bag
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heatsink compound paste for computer cpu X23-7783D-2g-Tube mini bag

FOB Price

Get Latest Price

1.3 USD / Piece

|

100 Piece Minimum Order

Country:

China

Model No:

X23-7783D-2g

FOB Price:

1.3 USD / Piece Get Latest Price

Place of Origin:

-

Price for Minimum Order:

1.3 per Piece

Minimum Order Quantity:

100 Piece

Packaging Detail:

box

Delivery Time:

2 to 7 days

Supplying Ability:

500000 Piece

Payment Type:

Western Union, PayPal

Product Group :

Contact Now
Free Member

Contact Person Ms. Angela

HengGang Town LongGang District,ShenZhen,P.R.China, Shenzhen, Guangdong

Contact Now

Product Specification

  • Color:Grey
  • Thermal Conductivity:6.0
  • Thermal Impedance:0.225â-in2/W
  • Specific Gravity:2.2
  • Evaporation:0.001
  • Dielectric Constant:5.1

Product Description

Model:X-23-7783D
origin :japan
applicable objects:  CPU、MPU
performance   : High thermal conductivity and high practicality 
describe 
X-23-7783D Thermal conductive silicone belongs to nanotechnology thermal conductive silicone, added the high-performance metal thermal conductive materials and thermal conductivity, focus on the high thermal conductivity and operability, and add about 2% of isoalkane. The most suitable as CPU heat dissipation, MPU TIM - 1 material. The thermal conductive silicone is Japan letter more adopts nano material, nano silicon grease, according to the demand of the market the application of new nano technology of thermal conductivity, in adding the nanometer thermal conductive materials and thermal conductive silicone makes excellent thermal conductivity silicone grease can fill the gap between the radiator and IC, achieve the best cooling effect, believe there are two more X - 23-7762, G751, also be using nanotechnology in thermal conductive silicone products. 
 
 
 
parameter 
proportion: g/cm3 25℃ 2.55
viscosity : Pa·s 25℃ 200
From the oil  % 150℃/24h —
thermal conductivity:  6.0 W/m.k
breakdown voltage : kV/mm 0.25MM  
temperature range  -50~+120℃
vocs :% 150℃/24 h 2.43    PPM ∑D3~D10 100  
 
 
 
Range of application 
used in high performance computer CPU motherboard radiator filler material, this type of CPU heat up more quickly, send out quantity of heat is more, it need the radiator and the requirement of the thermal conductive silicone is quite high. Solve the above problems, so in the letter, the more targeted to launch a high ratio of a thermal conductive silicone: SHINETSU the letter X - 23-7783 - d. 
- for the radiator industry market situation, letter of thermal conductivity of the silicon grease is has the certain leadership in terms of high conductivity, Japan SHINETSU letter the more high performance models including thermal conductivity of silicon grease :X-23-7783D、X-23-7783D、G-751。

 

Product picture  

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SGS

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Country: China
Model No: X23-7783D-2g
FOB Price: 1.3 / Piece Get Latest Price
Place of Origin: -
Price for Minimum Order: 1.3 per Piece
Minimum Order Quantity: 100 Piece
Packaging Detail: box
Delivery Time: 2 to 7 days
Supplying Ability: 500000 Piece
Payment Type: Western Union, PayPal
Product Group : HC180

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To:

Ms. Angela < Shenzhen Bonyx Electronics Co., Ltd >

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