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Laptop BGA Rework ZM-R5860C Hotair BGA rework station, solder BGA

FOB Price

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1 Set Minimum Order

Country:

China

Model No:

ZM-R5860C Rework laptop BGA machine

FOB Price:

(Negotiable) Get Latest Price

Place of Origin:

shenzhen

Price for Minimum Order:

Minimum Order Quantity:

1 Set

Packaging Detail:

standard wooden box package, G.W. is 78KG. dimension is L78*W78*H77cm

Delivery Time:

1-2 workdays after order confirmed

Supplying Ability:

600 Set per Month

Payment Type:

Other, PayPal, Western Union, T/T

Product Group :

bga rework station

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Shenzhen Zhuomao Technology Co., LTD

China

Free Member

Contact Person Ms. cathy

Baoan district, Shenzhen, Guangdong

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Product Specification

Function:rework, reflow and repair BGA Chip
usage:rework BGA Chip of laptop,xbox360 and mobile
Business type:manufacturer
Certification:CE and ISO9001:2009
Warranty:1 year

Product Description

ZM-R***0C BGA Rework Station for Laptop, xbox**0 and mobile BGA Chip

Specifications and technical parameters:

1	Total Power	***0W
2	Top heater	**0W
3	Bottom heater	2nd heater *0W, 3rd IR heater *0W
4	Power supply	AC*0V±0ï¼… 0/0Hz
5	dimension	L*5W*0H**0mm
6	Positioning	V-groove, PCB support can be adjusted in any direction with external universal fixture
7	Temperature control	(K Sensor) closed loop, independent heating, precision within±3°.
8	PCB size	Max 00mm Min 0**0 mm
9	Electrical selection	Highly sensitive temperature control moduleï¼‹Touch screen (Taiwan)
*0	Weight	*4kg

Main Features

1,Adopt liner slide which makes X,Y,Z axis all can do precision adjustment or fast positioning, with high positioning accuracy and fast maneuverability,

2,high definition touch screen , PLC control, can save multiple groups profile, password protection and modify function, and can save multiple groups profile, equipped with instant temperature curve analysis function,

3, There are 3 independent heating areas from top to bottom. The 1st and 2nd are hot-air heaters, the 3rd is IR preheating, temperature controlled within±3 °, Top heater can be adjusted freely, second heater can be adjusted up and down, top and bottom temperature can control many groups and sections of temperature parameters at the same time; the third IR heater can be adjusted the power consumption.

4,Offer all kinds of hot-air nozzle, it can rotate **0°,With magnet, easy to install and change, customized is available; Bottom IR heater ensure an even heat for PCB board.

5, Choose imported high-precision K-type thermocouple, closed loop control and automatic temperature compensation system, combined PLC module for the precision control of temperature.

6, Use a V-groove equipped with a flexible fixture for PCB positioning to protect the PCB from deformation when heated or cooled, and it can rework for any BGA package size.

7, powerful cross-flow fan rapidly cool the PCB board to improve efficiency, also built-in vacuum pump and external vacuum suction pen, pick up the chips rapidly.

8, after finishing disordering & soldering, there is an alarming and alarming in advance.

9,CE certificate, with emergency stop and Automatic power-off protection device when abnormal accident happens, with a double over-heating protection control.

Country:	China
Model No:	ZM-R5860C Rework laptop BGA machine
FOB Price:	(Negotiable) Get Latest Price
Place of Origin:	shenzhen
Price for Minimum Order:	-
Minimum Order Quantity:	1 Set
Packaging Detail:	standard wooden box package, G.W. is 78KG. dimension is L78W78H77cm
Delivery Time:	1-2 workdays after order confirmed
Supplying Ability:	600 Set per Month
Payment Type:	Other, PayPal, Western Union, T/T
Product Group :	bga rework station