Lead Free Reflow Oven SM series

Product Description

Features  
    
PC Control System
Huge memory capacity or data storage with Windows program
provide user friendly data analysis
-        Storage of entire year of production records and information ,
graphic analysis , machine trouble-shooting records…etc
-        Excellent on-line thermo-graph monitoring & analysis, data
storage & setting , convenient for production application

Heat Zone
-        Individual module heat zone design facilitate easy maintenance
Hot Air Circulation System  by Jet Nozzles
-        Independently upper and lower-deck heating element systems
with individually air force circulation control, specially designed for
lead-free soldering technology maintain depletion temperature of
PCB at +/- 2 degrees C
-        Prevents non heated areas and shadowing
-        Our high performance heating elements generates the hot air
rapidly with low velocity hot air heating to the PCB & components
-        High performance convection motor ensures stable voltage
output with life time warranty

Forced Cooling System
-        Specialized design cooling zones provides the best cooling
environment for the PCB after the solder process
-        External closed loop industrial chiller ( Optional )

Auto Lubrication Rail Device
-        Increase the reliability for both the chain & rail，resulting in
stable transmission .
Transmission System
-        High rigidity & strength special aluminum-alloy rail design with
double flex clearance base ensures non deformation even in very
high temperature condition

Safety & Maintenance
-        The upper construction adopts electrical screw type lift-up
device, safe and easy for maintenance .
-        Electrical failure protection function by UPS which ensure the
PCB output from the system