Low temperature solder Special copper-hafnium alloy brazing filler met

Product Description

Low temperature solder Special copper-hafnium alloy brazing filler metal for brass carbon steel


Background:
For existing phosphorus, solders like copper-phosphorus, copper-phosphorus-silver, and copper-phosphorus-tin are easy to volatilize under high temperature welding, and causing defected welding such as weld porosity and sand hole. To solve this problem radically, team of JH R&D developed solders of copper and rare earth alloy, featured in good fluidity, spread ability, high strength welding, and the key point is lower than 0.*1% rate of welding weld porosity, consequently, an ideal alternative for traditional copper and silver brazing solder.

Features:
Low rate of weld porosity
Lower than 0.*1% rate of weld porosity, which is far beyond the one of copper basic solder and silver basic solder.
Low cost
The quaternary alloy solder of copper and rare earth, lower cost, better effect of welding compare with silvers.; and the priority alternative of silver solder.

Low temperature of brazing
The brazing temperature is within **0 and **0 degree.

Applications:
Brazing with brass and carbon steel, brass with stainless steel, brass with red copper, and both of copper together Jing Gu liquid solder.
Ingredient: Cu Hf Rera earth
Solidus:      JH***3TH-A **0
Liquidus:      JH***2TL-D **0
Specification:  1.8,  2.0 ;  2KG/Roll , 5KG/Roll
Shape: Strip,Ring
Application:             JH***3TH-A Instead of 2%Ag brazing solder
JH***3TH-B Instead of 5%Ag brazing solder
JH***3TH-C Instead of *0%Ag brazing solder
JH***3TH-D Instead of *5%Ag brazing solder
Brazing Method: Manual flame brazing, automatic flame brazing , high frequency brazing
Anti-corrsion Test: Qualified at more than **0hrs salt spray test
Joint Strength:      JH***3TH-A 1.2 times of parent materials strength
JH***3TH-B 1.2 times of parent materials strength
JH***3TH-C 1.5 times of parent materials strength
JH***3TH-D 1.8 times of parent materials strength