Metal Base Copper Clad Laminates

Product Description

Aluminum Base Copper Clad Laminates：
BRAF***1  Type Common Aluminum Base Copper Clad Laminates：
Thermal Conductivity:0.8W/m.k
BRAF***1  Type TG Aluminum Base Copper Clad Laminates：
Thermal Conductivity:1.0W/m.k
BRAF***3  Type High Thermal ConductivityAluminum Base Copper Clad Laminates：
Thermal Conductivity:1.2W/m.k
BRAF***4  Type High Thermal Conductivity Aluminum Base Copper Clad Laminates：
Thermal Conductivity:1.5W/m.k
BRAF***5  Type High Thermal Conductivity Aluminum Base Copper Clad Laminates：
Thermal Conductivity:2.0W/m.k
BRAF***6  Type High Thermal Conductivity Aluminum Base Copper Clad Laminates：
Thermal Conductivity:2.5W/m.k

Characteristic：High thermo conductivity,Low Thermal Expansion,Low Thermal Resistance.Dielectric Material：Strong Intensity,Low Expansion,High thermo conductivity,High Temperature Resistance.

Application：Such as: High brightness LED,lighting,LCD backlight module,etc. The output amplifier,balanced amplifier,preamplifier,etc.The transistor base,solid state relays,power supply units,etc.Power supply,DC transformer,automobile electrical module,etc.



Nominal Thickness:  0.6mm  to  5.0mm

Nominal Thickness:  ***0mm to ***0mm