Movable Lower Heating Zone SMD BGA Rework Station

Product Description

Features

1. High quality heating material ensures desoldering and soldering procedures of BGA are precisely controlled;
2. lAuto-generated profile, no need to adjust or change temperature on the profile;
3. Adjustable Air flow and temperature within a wide range to produce high temperature breeze;
4. Movable heating head for easy operation
5. Touch screen interface; 3 heaters; real-time temperature curve display on touch screen;
6. Embeded industrial computer, PLC control; able to disply set profile and testing profile at the same time; analyze the profile,compared with saved history profiles;
7. 8 segments of temperature up(down) and 8 segments constant temperature control, unlimited profiles saving;
8. Up/down adjustable lower hot air nozzle;
9. Buzz after soldering or desoldering is finished;
10. lWith different alloy hot gas nozzles, easy to replace.It could be tailored as per the specific requirements.
11. The whole bottom IR preheating area can move along with X axis, so as to meet the need of Technology parameters Style NO. WDS***0s Maximum PCB size L**0*W**0mm PCB thickness 0.5~2.5 mm Chips apply 1*1~*0**0mm Chip minimum space apply 0.*5mm PCB locating way Fixture located Temperature controlling way K-tape thermocouple, closed loop control Lower hot air heating Hot air ***0W Upper hot air heating Hot air **0W Bottom pre-heating IR ***0W Power applies Single phase: **0V, *0/*0 Hz Machine size L**0*W***0*H**0mm Machine weight Approx*0KG