multi solar wafer

Product Description

Packaging & Delivery
Packaging Detail: bubble/carton/wood box
Delivery Detail ***0days

Specifications
multi solar wafer
**6mm multi solar wafer
Model: P

multi solar wafer

**6mm multi solar wafer

Type: P
Dopant: Boron
Resistivity: **3(ohm.cm)
Dimension: **6 x **6±0.5 (mm)
Thickness: **0±*0 (μm)
Oxygen Content: ≤8.0 x ***7  
Carbon Content:  ≤1.0 x ***8 
Minority Carrier Lifetime: ≥2 (us)
Microcrystal: <*0/cm2 
Saw Depth:  <*0 (μm)
TTV: <*0(μm)
Bow: <*0 (μm)
Bevel Edge Angle:  *5°±2°
Bevel Edge Length:  1±0.5 (mm)
Rectangular Angle  <0.3°
Edge Defect: No crack, no V-Shape Chip
Surface Quality: As cut, cleaned, no stain; No water mark, no contamination, no pits on the surface.
Edge Chips: Length<0.5mm, Depth<0.3mm,<2 per wafer.