Printed Circuit Boards

Product Description

Base Material XPC,FR*1,CEM*1,CEM*3, FR4 FR*4; Aluminium Base; High Frequency; PTFE; FPC; Thick Copper; Paper Base; BT Base; Pi Base; Rogers***3 (PPC: ***3) Base Copper Thickness 0.**6oz(*7um***0um) Max Layer *0 Layer Max Board Size **0 mm x **0 mm,**0****0mm Hole size (min) 0.2 mm Min. width / space 0.1mmm / 0.1mm Min. bonding pad w/s 0.1 mm / 0.1mm Routing Min 1 mm CNC M/C Hole Accuracy 0.*5 mm Out Line (L x W) Tolerance �?�±0.1 mm Solder Mask Thickness *0(*0) �?�¼m V-cut Location Thickness 0.1 mm V-cut Depth Tolerance *0% or 0.1 mm CCL Tic V-cut Beveling *0 ~ *0 (user spec) C.C.L. Thickness Both sides: 0.1 ~ 3.2T M.L.B.:0.*5 ~ 7T Finishes Hot Air Leveling Flash Gold GoldFinger Electronic Gold Plating OSP Immersion Ni/Au