RFID Inlay Production Line.

Product Description

Configuration: 1. Roll Fixture-The roll of the substrate with printed antenna can be built in it. 2. Filling Machine-The chips can be picked up from the feeder and placed to the substrate. 3. Hot stamping Machine- Solidified the conductive adhesive between chip and antenna. 4. Testing Module- Reading and writing the completed inlays for inspecting. 5. Slitting Module- Upon completion, the roll can be slit into individual streams. 6. Collecting Machine- The individual roll can be collected by this unit. Options*: 1. Feed Chips From Wafer -Feed inverted chips direct from Wafer to the next stage. 2. Feed Chips From Tray -Feed inverted chips direct from Tray Pad to the next stage. 3. Protecting Colloid Module-To protect the juncture of the RFID chips and substrates. Increase the IP (International Protection) level of the RFID Inlay. 4. Personalized Module- Personalize a set of RFID Tags synchronously. Functions: 1. Material Conveying: Reel to Reel or Sheet to Sheet. 2. High output and low cost. 3. The line based on the ACP (Anisotropic Conductive Paste) technology. 4. Including adhesive application, flip chip attach, curing, testing and slitting. 5. Highest flexibility for HF & UHF chips to cover all inlay and strap formats. 6. Fully adjustable thermode temperature and pressure for individual thermode. 7. High precision adhesive dispense unit. Features and Benefits: 1. Higher cost effectiveness. 2. Most of components and materials from well-known suppliers are already evaluated. 3. The advanced die bonding machines which can carry out high-speed flip chip assembly. 4. Investing in our equipment maximizes your Return-On-Investment. 5. Proven design offers high reliability and low MTTR and faster troubleshooting. Specifications: 1. Output:***0UPH, ***0UPH, ***0UPH. ***0UPH, ***0UPH, ****0UPH. 2. Accuracy of placement with vision system is *0 microns. 3. Smallest die handling down to 0.*5 x 0.*5 mm. 4. Using wafers with a diameter of up to *2 inches. 5. Wafer feeder is an option. 6. Modular Construction. Material: 1. PET, Paper etc. 2. Substrate Size: (Reel to Reel) a)Strap: **0mm, **0mm (Multi-Row, Wide) b)Strap: **0mm (Multi-Row, Middle) c)Strap: **0mm (Multi-Row, Narrow) 3. Coil Size: (Reel to Reel) a)Inside Diameter：*6mm b)Outside Diameter：**0mm c)Thickness：over 0.*3mm 4. Antenna: Silver, Aluminium, Copper Mechanical: 1. Length: ***0 mm (**6 in) 2. Weight: ***0 kg (****7 lb) 3. Latching Current: *0A 4. Power Consumption: *0kw Compressed Air Supply: 1. Barometric Pressure of Compressed Air: 7Bar 2. Amount of Compressed Air: **0 NL/min 3. Condition of Compressed Air: 5 micron filter, dry, oil free Web Control: 1. Automatic Tracking 2. Tension Control Power Requirement: **0VAC�5% , *-phase, *0/*0Hz. Environmental: 1. Operating temperature: *0℃~*0℃ 2. Storage temperature: 5℃~*0℃ 3. humidity: 5%~*0% We can also make special items as your requirement.