SAC305 lead free smd solder paste, tin silver soldering paste

Product Description

1. Introduction: Our Sn*6.5Ag3.0Cu0.5 SAC**5 lead free silver solder paste adopts the alloy which is formed by the *6.5% tin, the 3% silver, and the 0.5% copper. This product is desirable for the reflow soldering process which has relatively high demand. Its working temperature can be divided into three types. The preheat temperature varies from **0 degrees Celsius to **0 degrees Celsius. The melting temperature is **7 degrees Celsius, and the reflow temperature ranges from **0 degrees Celsius to **0 degrees Celsius.

The Sn*6.5Ag3.0Cu0.5 SAC**5 lead free silver solder paste has passed the SGS test, and achieved multiple certifications, including RoHS, REACH, and some others. Our lead-free solder cream has been exported to Germany, Russia and Spain. Moreover, we are looking for agents on a global scale. Please contact us, if you show interest in our product. 2. Chemical Component Data Sheet:

3. Physical Properties:

5. Storage, Operation and Storage Life: 

1. We suggest that the Sn*6.5Ag3.0Cu0.5 SAC**5 lead free silver solder paste should be kept in cold storage at the temperature range from 2 degrees Celsius to 8 degrees Celsius. The warranty period is 6 months from the date of production. Our goods ought to follow the First in First out principle.

2. Before being used, the solder paste needs to be kept at a room temperature. The recommended time is 4 hours. After the recovery of room temperature, the storage life is *8 hours. After the product is unsealed, the storage life is *2 hours. It takes **0±*0 minutes to make the solder paste stay on the printed circuit board before the reflow soldering process begins.