Silicon Thermal Pad

Product Description

"MAP" thermal interface pad is a silicon rubber material specially formulated for low-stress applications that require amid-to-high-thermal conductive interface material the highly conformable nature of the material allows the pad to fill in the air voids and air gaps between PC board and heat sinks or metal chassis withstepped topography, fough surfaces, adn high sticeup tolerances, these pads consist of a 0.*2inch *- 0.4inch (********0mm) thick, electrically non-conductive. If you have any inquiry regarding any item, it will be highly appreciated. Hope this will be the beginning of good business relationship between our companies for mutual benefits. Hope to start good & long business relationship for mutual benefits. We look forward to developing long-term business relationship with you. It will be a pleasure, and we anticipate hearing from you soonest as we hope to cultivate a lucrative / profitable trade link for mutual benefits. For more styles and information please checkout our catalog and inquire about our products, and don�t hesitate to contact us