Slitong ceramic PCB circuit board / ceramic circuit board hole filling

Product Description

         Remarks: the above quoted price is the actual quoted price of non - product, and the specific quoted price is evaluated according to your product drawingI'll give you the exact price!!!

   Company introduction

          Decimating Skywin Technology (Wuhan) Co., Ltd., is a professional engaged in the plane and three-dimensional inorganic non metal based electronic circuits and electronic components research and development, production and sales of high-tech enterprises, which owns the well-known brand of ceramic circuit board *- Slitong.

        The company's main products are ceramic circuit board, such as alumina ceramic, aluminum nitride ceramic, zirconia ceramic, glass, quartz, adopting metal technology of laser rapid activation (Laser Activation Metallization, referred to as LAM) production.- between the metal layer and the ceramic with high strength, good electrical properties, can be repeated welding, metal layer thickness can be adjusted within 1 m*1mm, L/S resolution can reach *0 m, can be directly realized through holes to connect, to provide customized production service for customers.

       The product has a number of patents in the development and production process, technology has completely independent intellectual property rights, the current annual production capacity of ****0 square meters.

        The company has professional production, technology research and development team, advanced marketing management system and high quality soft and hardware facilities. A systematic decision process and a rigorous warehouse management system ensure the efficiency of our production capacity. We are committed to providing the most professional, fastest and most intimate customized services to customers around the world.

                                              Brand introduction - Litong

         As a leader in hi tech + Internet mode, our company is committed to providing high quality products and more intimate service to every customerCutting edge technology: LAM technology, DPC Technology

         Team Honors: Wuhan national Optoelectronics Laboratory, Huazhong University of Science and Technology R & D team, participated in international electronic exhibitions several times

         Close service: fast production cycle, customized production according to customer's drawings

         Brand core: focus on cutting-edge technology, walking in the forefront of science and technology, so that technology and products to grow together, the achievements of different industry cutting-edge brands.

                                                Process introduction

         LAM: our products by the national invention metallization technology rapid activation of patent (Laser Activation laser Metallization, referred to as LAM) production, using ceramic and metal ion beam of high-energy laser, so that the two are firmly combined. LAM technology can realize large-scale production of single-sided, double-sided and 3D ceramic circuit boards. The product has high precision and good adhesion, and the conductive layer can be customized from 1 m to 1mm according to customer's requirements. The use of pure copper instead of silver paste can solve the problem of conductivity and adhesion of the hole, and the overall performance is more stable. The process is mature and the performance of the products is excellent. High precision wiring can be achieved by laser incident 3D surfaces. Free from the appearance limit, the design space is more imaginative, the cost is lower than the traditional technology, no mold opening, environmental protection and pollution-free, and the application field is extensive.

       

       DPC Technology: thin film method is the main method of metal film deposition in microelectronic manufacturing, among which direct copper plating (Direct, plating, copper) is the most representative. Direct copper plating (DPC), mainly by evaporation and magnetron sputtering deposition process of metal substrate surface, first under vacuum sputtering of titanium, chromium and copper particles is, finally electroplating thickening, followed by ordinary PCB technology to complete production line, then the chemical plating / deposition increase line thickness.