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Trusted USA Manufacturer of Custom High Density Interconnect PCBs
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Trusted USA Manufacturer of Custom High Density Interconnect PCBs

FOB Price

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( Negotiable )

|

100 Unit Minimum Order

Country:

USA

Model No:

-

FOB Price:

( Negotiable ) Get Latest Price

Place of Origin:

Maryland, United State of America

Price for Minimum Order:

-

Minimum Order Quantity:

100 Unit

Packaging Detail:

PCB Electronic Circuit Board PCB Assembly >> PCB: Vacuum Packing with Carton Box &

Delivery Time:

24 Hours - 4 weeks

Supplying Ability:

10000 Unit per Week

Payment Type:

-

Product Group :

-

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Free Member

Contact Person Ms. Michael

4420 Buckeystown Pike, Frederick, Maryland

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Product Specification

  • Brand Name: High Density Interconnect PCBs
  • Base Material: FR4, Rogers and many more
  • Copper Thickness: 0.5 - 4 oz. inner / 1 - 20 oz. outer
  • Board Thickness: 0.40mm – 3.20mm
  • Min. Hole Size: 0.15mm
  • Min. Line Spacing: 1.2/1.2 mil
  • Surface Finishing: OSP, ENIG, Immersion tin, Immersion silver, Electrolytic gold and many more

Product Description

Circuits Technologies provides a complete range of services to our customers in PCB prototypes and PCB manufacturing, allowing them the freedom to have a one stop shop for their PCB requirements. Our product offerings include rigid PCBs, rigid flex PCBs and HDIs.

HDI PCBs feature high-density attributes such as microvias, buried vias, and blind vias. These features enable more complex interconnections and improved performance in advanced technology applications.

HDI PCBs have higher interconnect density per unit area requiring more sophisticated technology and manufacturing processes for their production. HDI PCBs are boards with high-density characteristics including micro-sized holes, fine lines and can be constructed with thin high performance materials, thereby enabling more interconnected functions per unit area.

HDI *@******************** 1+N*1 PCBs contain 1 "build-up" of high-density interconnection layers.

i+N+i (i≥2) - PCBs contain 2 or more "build-up" of high density interconnection layers. Microvias on different layers can be staggered or stacked. Copper filled stacked microvia structures are commonly seen in demanding designs.

For more detailed technical information and our capabilities, visit our website to view our Technical Capabilities.

Country: USA
Model No: -
FOB Price: ( Negotiable ) Get Latest Price
Place of Origin: Maryland, United State of America
Price for Minimum Order: -
Minimum Order Quantity: 100 Unit
Packaging Detail: PCB Electronic Circuit Board PCB Assembly >> PCB: Vacuum Packing with Carton Box &
Delivery Time: 24 Hours - 4 weeks
Supplying Ability: 10000 Unit per Week
Payment Type: -
Product Group : -

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Ms. Michael < Circuits Technologies LLC >

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