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Sireda Technology Co, Ltd

Hanhaida High-Tech Park,Shenzhen,Guangdong,China China

1st Year
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Home Company Sireda technology Co, Ltd Products

Products: 9

BGA QFN LGA MCM test Socket ic test and burn-in socket  eMMC connector, eMCP contactor, NAND flash programmer adapter
BGA QFN LGA MCM test Socket ic test and burn-in socket eMMC connector, eMCP contactor, NAND flash programmer adapter

provide customized ic test and burn in socket for all kinds of IC pitch:0.35-1.27mm size:different package:BGA, LGA, QFN, QFP, SOP, MCM, POP, BGA162/1

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DDR3, DDR4, DDR5, LPDDR test fixture, test socket pogo pin orconducting resin
DDR3, DDR4, DDR5, LPDDR test fixture, test socket pogo pin orconducting resin

Sireda Technology supply high quality & stable performance DDR SDRAM testing solution. Use strong abrasive resistance GCR as contact, reduce the tran

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BGA186(eMCP) Socket SD Solution_12X13.5mm Perform ic tester test socket date reader recovery eMCP Socket, eMCP adapter
BGA186(eMCP) Socket SD Solution_12X13.5mm Perform ic tester test socket date reader recovery eMCP Socket, eMCP adapter

is_customized:Yes Brand Name:SIREDA Model Number:702-0000003 Package:BGA Pitch:0.5mm Pin Count:162/168 IC Size:12X13.5mm Structure:Clamshell Contact

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BGA153(eMMC) Socket SD Solution_11.5X13mm Premium ic tester test socket date reader recovery eMCP Socket, eMCP adapter
BGA153(eMMC) Socket SD Solution_11.5X13mm Premium ic tester test socket date reader recovery eMCP Socket, eMCP adapter

is_customized:Yes Brand Name:SIREDA Model Number:702-0000058 Package:BGA Pitch:0.5mm Pin Count:153 IC Size:11.5X13mm Structure:Clamshell Contact:Sprin

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MSM8976 CPU MT6763  IC test fixture Socket, BGA186 eMCP tester.test solution, BGA NAND Flash test solution
MSM8976 CPU MT6763 IC test fixture Socket, BGA186 eMCP tester.test solution, BGA NAND Flash test solution

TheTEST FIXTUREis designed for test, debug, validation, and programming of eMMC, eMCP, RF, CPU, etc.

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BGA169(eMMC)  Socket USB Solution, BGA153, eMMC test socket, tester.test solution, BGA NAND Flash test solution data recovery
BGA169(eMMC) Socket USB Solution, BGA153, eMMC test socket, tester.test solution, BGA NAND Flash test solution data recovery

703-0000089_BGA169(eMMC) Socket USB Solution_14X18mm TheUSB solutionis designed for test, debug, validation, and programming of eMMC, eMCP devices Th

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BGA221(eMCP) Socket USB Solution, BGA186, eMCP test socket, tester.test solution, BGA NAND Flash test solution
BGA221(eMCP) Socket USB Solution, BGA186, eMCP test socket, tester.test solution, BGA NAND Flash test solution

703-0000092_BGA162(eMCP) Socket USB Solutions_12X16mm TheUSB solutionis designed for test, debug, validation, and programming of eMMC, eMCP devices

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BGA153 Socket USB Solution_ Pitch 0.5mm _ 11.5x13mm , High-speed Read & Write Solution, eMMC Test, IC Socket
BGA153 Socket USB Solution_ Pitch 0.5mm _ 11.5x13mm , High-speed Read & Write Solution, eMMC Test, IC Socket

Item specifics Package:BGA Pitch:0.5mm Pin Count:221 IC Size:11.5X13mm Structure:Clamshell Contact:Spring Probe Product Description BGA153 S

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ATE test socket for QFN, QFP, LGA, BGA, module.MCM test fixutre,
ATE test socket for QFN, QFP, LGA, BGA, module.MCM test fixutre,

Torlon is used as socket body material, apply Aluminum Alloy to socket lid. make the socket durable. QFP44 socket lid Pogo pin contact, life cycle

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