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13C,D, Shenmao Business Center, No.3 Jingtian, ShenZhen, GuangDong,China
Product Units KD**1 KD**2 Test method Backing Thickness: mm 0.**5 0.**5 Total Tape Thickness: mm 0.**0 0.**6 Adhesion to Steel: N/cm 1.4 2.5 GB-T***2 Tensile Strength at Break: N/cm *8 *8 GB-T***3 Elongation at Break: % *0 *0 GB-T***3 Upmost use Temperature : ° C **0 **0 Surface resistance: ohms >**6 >**6 Static Charge: Removal from roll: V <**0 <**0 Removal from SUS: V <*0 <*0 Application Mask for printed circuit boards during wave solder or solder dip process. Features Employs a proprietary technology that results in extremely low electrostatic discharge at unwind and removal form SUS. Conventional polyimide tape typically generate over *0, **0volts during use which can damage around electronic components . The low static properties of KD**1/**2 can eliminate circuit board degradation. Storage Details Store under normal conditions of *0° to *0°C and *0 to*0% R.H. in their initial packaging. shelf life is 6 months from the date of manufacture.