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Wafer polishing slurry

Wafer polishing slurry

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ACE NANOCHEM

South Korea

Free Member

Contact Person Ms. helen

Jain, gyungsan, gyung-buk

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Description

Featuresï&frac*4; â High speed polish: with large particle of colloidal silica (big size up to **0 nm) â Controllable size: a wide range of custom-graded colloidal silica slurries from *0 to **0 nm that suits individual needs and applications â High purity: contamination on the work piece â Super-smooth polishing: with the particle of SiO2, avoid scratch on the object surface

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Ms. helen < ACE NANOCHEM >

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