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Contact Person Mr. Michael
Room 1204, Incubation Building, Wuhan Institute of Technology, Wuhan, Hubei
SPS Bis-(sodium sulfopropyl)-disulfide Intermediate for copper electroplating 1) CAS NO. *********5 2) Molecular formula: C6H*2O6S4Na2 3) Molecular weight: **4.4 4) EINECS NO. ********3 5) Applications: brightener in copper baths for decorative and functional deposits 6) Appearance: White or yellowish powder 7) Concentration in the bath:*****0mg/L 8) PH Value: **7(*8%water solution) 9) Storage condition: Stored in cool and dry place *0) Valid period(year): 2
