BGA rework station RD500

Description

Detail Instruction 1. This machine uses the intelligent heating, when the fan non-move, heating is not receiving power. 2. The COM connection, with the computer connection, realizes the high-end to return to the machinery of repair function. 3. Rich software function: Contact surface succinct friendly, the hypothesis, the revision, the preserved parameter, the parameter number of classes has not limited; The temperature curve test, the analysis, the printing, preserve; The automatic tracking thermal process, the thermal process curve draws up automatically; Temperature installation, temperature drift correction; Password locking mechanism, condition permission mechanism and so on. 4. Three .independent heating zone, suitable for lead-free process. 5. The first heating zone, a second heating zone heater using high-temperature heating material, producing a breeze, the third heating zone infrared heating plate heater to prevent PCB deformation; 6.6 temperature controls that simulate the effect of reflowing solder machine. 7. The first heating zone heater can be adjusted up and down, around, easy operation; 8. After the adoption of the heating of large flow constant fan on PCB for cooling to prevent PCB welding deformation, guarantee; 9. BGA remove, welding is voice prompts; *0. Hand-held vacuum wand sucks BGA, convenient, reliable, durable; *1. Card board with a special tooling for a wide variety of notebook motherboard; *2. With. more than one size of hot air nozzle, or according to special requirements for custom; *3. Adopting. P L C, human-machine interface control.