Sell HB-200 Desktop Dual Adhesive Dispenser

Description

Application Scope Semiconductor sealing, PCB component fixing and protection, horn gluing, art craft cementing, quantitative adhesive filling, chip bonding technique, etc. Technology Parameters Max. Load: X/Y/Z *0/*0/5KG Max. Speed:1, **0mm/s Positioning precision: 0.*1mm Precision resolution: 0.**1 Operating stroke: **0***0**0mm, optional non-standard stroke available Controle mode: movement control card demonstration programmer (touch screen human-machine interface demonstration programmer is optional) Motor system: Japanese micro step precision motor Program storage capacity: **0 sets Movement system: synchronous belt precision slide rail step motor Overall size: **0***0****0 Input pressure: 0.**0.7 MPa Power voltage: AC**0V Environmental humility: ****0% Weight: *0KG Performance 1) High-speed movement card touch screen control system; easy operation training; 2) Mixed movement program function for points, lines and irregular curves; 3) Three-axle interlink to realize 3D adhesive dispension; 4) Graph by CAD/CAM software can be imported for track edition; 5) High speed air path adhesive control system providing stable and accurate adhesive quantity; 6) Circulable work mode, effectively saving energy. Optional control system: Touch screen demonstration programmer Professional dual adhesive dispension head