Description
Sputter Coating Application: Sputter coating thin film primary
be used field include decorate thin film, construction glass,
automobile widow, low radiation glass, plane display, optical
communication/ optics field, light date store field, thin film
solar cell, magnetism date store field.
Backing Plates and Bonding Service: Backing plates include
OFHC copper, Aluminum, Titanium, Stainless steel or Molybdenum. The
dimension will base on your drawing and you design.
Bonding Service
A、Back metallisation up to ***0 x ***0mm
B、Metallic and non-metallic bond coverage >*8%
C、Ultrasonic c-scan on bond integrity
Sputtering Targets Shape and Size: Discs, Rectangle, Step,
Plates, Sheets, Tube, Foils, Rods, Taper, Ring, S-Guns,
Custom-Made.
Disk targets, column targets, step wafer targets (Dia<**0mm,
Thickness >1mm )
Rectangle Targets, Slice Targets, Step Rectangle Targets (Longth
<***0mm, Witdh<**0mm, Thickness>1mm)
Tube Target / Rotation sputtering Target (Outer Dia < **0mm,
Thickness > 2mm)
Sputtering Targets Materials list:
A、Metal Sputtering Targets: Aluminum (Al),Antimony (Sb), Bismuth
(Bi), Boron (B), Cadmium (Cd), Cerium (Ce), Chromium (Cr), Cobalt
(Co), Copper ( Cu), Dysprosium (Dy), Erbium (Er), Europium (Eu),
Gadolinium (Gd), Germanium (Ge), Gold (Au), Graphite, Carbon, (C),
Hafnium (Hf), Holmium (Ho), Iridium (Ir), Indium (In), Iron (Fe),
lanthanum (La), Lead (Pb), Lutetium (Lu), Manganee (Mn), Molybdenum
(Mo), Magnesium (Mg),Neodymium (Nd), Niobiums (Nb), Nickel (Ni),
Palladium (Pd),Platinum (Pt), Praseodymium (Pr),Rhenium (Re),
Ruthenium (Ru), Samarium (Sm), Scandium (Sc),Selenium (Se), Silicon
(Si), Silver (Ag), Tantalum (Ta), Terbium (Tb), Tellurium (Te),Tin
(Sn), Thulium (Tm), Titanium (Ti), Tungsten (W), Vanadium (V),
Ytterbium (Yb), Yttrium (Y), Zirconium (Zr), Zinc (Zn)
B、Alloy Sputtering Targets:AlCu,
AlCr,AlMg,AlSi,AlSiCu,AlAg,AlV,CaNiCrFe, CaNiCrFeMoMn, CeGd, CeSm,
CrSi, CoCr,CoCrMo, CoFe, CoFeB ,CoNi, CoNiCr, CoPt,CoNbZr,CoTaZr,
CoZr,CrV,CrB, CrSi, CrCu, CuCo, CuGa, CuIn, CuNi, CoNiPt,
CuZr,DyFe, DyFeCo, FeB,FeC, FeMn, GdFe, GdFeCo, HfFe, IrMn, IrRe,
InSn, MoSi, NiAl, NiCr, NiCrSi, NdDyFeCo, NiFe, NiMn,
NiNbTi,NiTi,NiV,SmCo,AgCu, AgSn,TaAl,TbDyFe,TbFe,TbFeCo, TbGdFeCo,
TiAl, TiNi, TiCr,WRe,WTi,WCu,
ZrAl,ZrCu,ZrFe,ZrNb,ZrNi,ZrTi,ZrY,ZnAl,ZnMg
C、Ceramic Sputtering Targets
1、Boride Ceramic Sputtering Targets: Cr2B, CrB, CrB2, Cr5B3, FeB,
HfB2 ,LaB6, Mo2B, Mo2B5 ,NbB, NbB2, TaB, TaB2, TiB2, W2B, WB, VB,
VB2, ZrB2
2、Carbide Ceramic Sputtering Targets :
B4C,Cr3C2,HfC,Mo2C,NbC,SiC,TaC, TiC, WC, W2C, VC, ZrC
3、Fluoride Ceramic Sputtering Targets : AlF3, BaF3, CdF2, CaF2,
CeF3, DyF3, ErF3, HfF4, KF, LaF3, PbF2, LiF, PrF3, MgF2, NdF3,
ReF3, SmF3, NaF, Cryolite, Na3AlF6 , SrF2, ThF4, YF3, YbF3
4、Nitrides Ceramic Sputtering Targets :AlN, BN,GaN, HfN, NbN,
Si3N4, TaN, TiN, VN, ZrN
5、Oxide Ceramic Sputtering targets: Al2O3, Sb2O3, ATO ,BaTiO3,
Bi2O3, CeO2, CuO, Cr2O3 ,Dy2O3 ,Er2O3, Eu2O3, Gd2O3, Ga2O3, GeO2,
HfO2, Ho2O3, In2O3, ITO, Fe2O3, Fe3O4, La2O3, PbTiO3, PbZrO3,
LiNbO3, Lu3Fe5O*2, Lu2O3, MgO, MoO3, Nd2O3, Pr6O*1, Pr(TiO2)2,
Pr2O3, Sm2O3, Sc2O3, SiO2, SiO, SrTiO3, SrZrO3, Ta2O5, Tb4O7, TeO2,
ThO2, Tm2O3, TiO2, TiO, Ti3O5, Ti2O3, SnO2, SnO, WO3, V2O5, YAG,
Y3Al5O*2, Yb2O3, Y2O3, ZnO, ZnO:Al, ZrO2(unstabilized),
ZrO*****5wt%CaO)
6、Selenides Ceramic Sputtering Targets: Bi2Se3, CdSe, In2Se3, PbSe,
MoSe2, NbSe2, TaSe2, WSe2, ZnSe
7、Silicides Ceramic Sputtering Targets: Cr3Si, CrSi2, CoSi2, HfSi2,
MoSi2, NbSi2, TaSi2, Ta5Si3, TiSi2, Ti5Si3, WSi2, V3Si, VSi2,
ZrSi2
8、Sulfides Ceramic Sputtering Targets: CuS, Sb2S3, As2S3, CdS, FeS,
PbS, MoS2, NbS1.*5, TaS2, WS2, ZnS
D、Other: AZO,Cr-SiO,CIGS,ITO,IGZO, GaAs, Ga-P, In-Sb, InAs, InP,
InSn, LSMO, Na3AlF6 ,YBCO, LCMO,YSZ
