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Electronic Packaging W90Cu Tungsten Copper Alloy Substrate

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1 ~ 20 / Piece ( Negotiable )

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$Zhuzhou Jiabang Refractory Metal Co., Ltd.$

Zhuzhou Jiabang Refractory Metal Co., Ltd.

China

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Contact Person Ms. Erin

No.8 Shayuan Road, Xiangtan, Hunan

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Description

vW-Cu material is a composite of tungsten and copper, with both tungsten low expansioncharacteristics, but also has copper of high thermal conductivity properties, and the tungsten andcopper in the thermal expansion coefficient and thermal conductivity can be adjusted with the W-Cucomposition, also the composite can be machined to various shape, these features make the applicationof this composite with great convenience. The thermal expansion can be adjusted to match with thefollowing material:

v(1) Ceramic materials: Al2O3(A**0,A**5,A**9),BeO(B**5, B**9),AlN,etc.;
(2) Semiconductor materials: Si, GaAs, SiGe, SiC, GaP, GaAs, AlGaAs etc.;
(3) Metal Material: Kovar alloy(4J*9), *2 alloy;

The quality of our composite is the leader in China, contributed with our strict quality control measures.Our porosity is very low; our surface/volume ratio (measured with BET) is only *0% of similarproducts in the market. (Based on the measurements of **0 pieces of 5*5*2 mm W**-Cu*0composite). Our products have high hermeticity and can pass the He mass-spectrometor leak test.(<<5**0^*9Pa·m3/S).

vOur Tungsten Copper Composite Features:
□No Fe, Co, Ni, Mn and other elements added as the sintering activator, to maintain a high thermalconductivity
□Excellent hermeticity
□Can provide semi-finished or finished (Ni/Au plated) products
□Precision machining and excellent dimensional control, surface finish and flatness
□With close technical supports including product design, custom manufacturing, testing and post salesupports.

vProduct Properties:
Physical Properties of Major Products

Type	Composition		Properties
	element	Content wt%	Density		CTE ppm/K	TC, W/m·K
	element	Content wt%	Mass density, g/cm3	Relative density, %T.D	CTE ppm/K	TC, W/m·K
W*0Cu	W Cu	*0±1 balance	*7.0	≥*9	5.6~6.5	0~0
W*5Cu	W Cu	*5±1 balance	*6.3	≥*9	6.3~7.0	0~0
W*0Cu	W Cu	*0±1 balance	*5.4	≥*9	7.6~9.1	0~0

Electronic Packaging W90Cu Tungsten Copper Alloy Substrate

Zhuzhou Jiabang Refractory Metal Co., Ltd.

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Electronic Packaging W90Cu Tungsten Copper Alloy Substrate

Zhuzhou Jiabang Refractory Metal Co., Ltd.

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