T-HS202301-SP5 liquid cooling plate

Description

High-Performance Liquid Cooling Plates for Data Centers CPU liquid cooling plate SP5 liquid cooling plate
CPU SP5 liquid cooling plate
The unique heat dissipation design cleverly directs the water cooling liquid to
the CPU, GPU, and artificial intelligence chips.Achieve excellent cooling and
heat dissipation performance. Its unique flow path design ensures that the
coolant can flow efficiently.Evenly distributed on each heat dissipation surface,
thereby significantly improving heat dissipation efficiency. Compared with
traditional heat dissipation methods.Heat sinks and fans enhance heat
dissipation more effectively.
Small batch customization with quick proofing
》High thermal conductivity material, precision processing.
 
》TLP welding, post-processing process.
 
》Efficient cooling performance, reliability and durability.
 
》Environmental protection and energy saving.
 
》Intelligent management, maintainability and flexibility.
 
Model ：T-HS*****1  Category：CPU  
Welding process：pure copper TLP welding  heat source Total power：**0W
Working environment：*0°C,2LPM,*5%EGW   cold plate surface temperature：below *2°C
flow resistance：Below *0KPa   Resistant to stress：1Mpa