ALN ceramic substrate

Product Description

Product Description :    
ALN ceramic substrate can directly bonds copper foil to the surfaces of AlN ceramic substrates under high temperature using DBC (Direct Bond Copper) Technology.
 
Product Feature :  
The composite made by it possesses good electric insulation capacity, high heat conductivity, superior soft solderability and high adhesion. Additionally, it can also etch different graphs just like PCB plate, and a large current carrying capacity. Therefore, DBC substrate has been used as the basic material in electric & electronic industry at home and abroad.
 
Product Specification / Models :  
ALN ceramic
Thickness 0.**5 0.5 0.*8mm
Density 3.3 g/cm3
Binding strength **0 Mpa
Thermal conductivity (at *5 degree Celsius) **0 W/m.k
Dielectric constant (at 1 MHz) 9.0
Dielectric loss (at 1 MHz, *5 degree Celsius ) 0.***3
Dielectric strength *0KV/mm
Volume resistivity (at *5 degree Celsius)  1**0^*4 cm
 
Copper parameter
Material: Oxygen free high purity copper *9.*9%
Copper Thickness: 0.4 0.3 0.*5 0.*0 0.**7mm
 
DBC Substrate:
Master card size (max.) **8***0 mm
Max. Usable area **7***8mm
Spacing between conductor (min) 0.5mm
Width of conductor (min) 0.5mm
Thermal expansivity (Normally) 7.4 **0^*6  K^*1
Peeling strength >5 N/mm
Soldrability >*5%
Surface options bare copper/solder stop/Ni-plating/Au-plating
 
Application :  
Concentrator photovoltail,
Solar converters,
Wind power plants,
Led lighting,
Thermoelectric coolers,
Airconditioning,
Power supplier,
IGBT modules,
IPM modules,
Mos modules,
power construction semiconductor elements,
ABS for auto,
Eletrical power steering,
Hybird Vehicles,
Eletric vehicles,
Laser,
Power supplies,
Hihg speed rail.
 
Other Information :       
Certification: ISO ***1, ISO****1,TS****9
We accept custom-made orders according to specific requests.
Some value maybe a little bit different from the table according to specification conditions.