FOB Price
Get Latest Price|
20 Piece Minimum Order
Country:
China
Model No:
DB118
FOB Price:
Place of Origin:
-
Price for Minimum Order:
-
Minimum Order Quantity:
20 Piece
Packaging Detail:
-
Delivery Time:
-
Supplying Ability:
-
Payment Type:
-
Product Group :
Contact Person Ms. Docbond
628Jiushui East Road Laoshan District, Qingdao, Shandong
DB**8
This product is a one-component epoxy resin adhesive with high thermal  conductivity, which is the best matching adhesive for thermal bonding of  chips. Applicable to all kinds of electronic products, characterized by rapid  thermal curing, and easy to apply. Upon cure, it has high bonding strength,  good thermal conductivity, low shrinkage, low moisture absorption, good  insulation performance, etc., which can reduce the working temperature of the  chip, extend the life of the chip
Country: | China |
Model No: | DB118 |
FOB Price: | Get Latest Price |
Place of Origin: | - |
Price for Minimum Order: | - |
Minimum Order Quantity: | 20 Piece |
Packaging Detail: | - |
Delivery Time: | - |
Supplying Ability: | - |
Payment Type: | - |
Product Group : | Electronic glue |