eMMC BGA153/169 test adapter with SD Interface, Clamshell Structure

Product Description

Features:
1. Apply to eMMC of Samsung, Sandisk, Toshiba, Hynix, Micron, HTC and Intel.
2. Apply to BGA**3 and BGA**9.
3. eMMC size of this product is *1.5x*3mm, we also provide other sizes of *2x*6mm, *2x*8mm and *4x*8mm.
4. Apply to eMMC thickness of 0.8 to 1.5mm.
5. With *0 pins and pin pitch 0.5mm.
6. Life cycle is around ****0 times.
7. eMMC data can be easily read and re-written.
8. Test can be done with or without solder ball.
9. Easy positioning and operation.
Only one frame guide for each fixture default, please tell us you wanted size. If need more, you should pay another $*0 for per standard size plate.

we're the original manufacturer !!! We can offer the lowest prices!!! The shortest processing time guaranteed!!!