eMMC test adapter with SD Interface, Open Top Structure, for BGA153 11.5_13mm BGA169 test socket, for data recovery

Product Description

Features:

1. Apply to eMMC of Samsung, Sandisk, Toshiba, Hynix, Micron, HTC and Intel.

2. Apply to BGA**3 and BGA**9.

3. eMMC size of this product is *1.5x*3mm, we also provide other sizes of *2x*6mm, *2x*8mm and *4x*8mm.

4. Apply to eMMC thickness of 0.8 to 1.5mm.

5. With *0 pins and pin pitch 0.5mm.

6. Life cycle is around ****0 times.

7. eMMC data can be easily read and re-written.

8. Test can be done with or without solder ball.

9. Easy positioning and operation.

Only one frame guide for each fixture default, please tell us you wanted size. If need more, you should pay another $*0 for per standard size plate.



We provide all kinds of IC test socket , eMMC/eMCP socket , SOP socket , TSOP socket , BGA socket and reballing fixture etc .



We're the original manufacturer , we can provide the excellent quality and  competitive price , if you have any inquiry , please don't hesitate to contact us ! ! !