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CYDCN-200
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Contact Person Ms. Jane
Yunxi, Yueyang, Hunan
Due to the multi-epoxy groups existing in the molecules of O-cresol formaldehyde epoxy reisin, a large amount of tight cross-bonds are formed after being cured, resulting in excellent thermal stability, mechanical strength, electricity insulation and chemicals resistance. It is mainly used in microelectronic industry. Widely used for the encapsulant of semiconductors and integrated circuits.
| Country: | China |
| Model No: | CYDCN-200 |
| FOB Price: | Get Latest Price |
| Place of Origin: | - |
| Price for Minimum Order: | - |
| Minimum Order Quantity: | - |
| Packaging Detail: | - |
| Delivery Time: | - |
| Supplying Ability: | - |
| Payment Type: | - |
| Product Group : | - |
