Qianli 4 IN 1 middle frame reballing platform

Product Description

Qianli 4 IN 1 middle frame reballing platform for Phone *3/*3 Pro/*3 Pro Max/*3 mini. Qianli Magnetic middle frame reballing platform 4 in 1 for Phone *3 series. Qianli Phone *3 series 4 in 1 double-sided middle layer reballing stencil platform regular/simple version for Phone *3 motherboard soldering repair. Qianli 4 in 1 motherboard tin planting platform for Phone ****3 Pro Max. 

Features:
Multiple Models: Suitable for Phone *3/*3Pro /*3Pro Max /*3Mini, innovative single-sided. 4 models universal to meet your maintenance needs.
Silicone non-slip foot pads, specific weighted iron plate at the bottom Silicone anti-slip foot pads are used at the bottom to effectively isolate the temperature, anti-skid and anti-scald, so that the tin planting position is more stable.
Stencils with no bulge under high temperature: 4 in 1 Middle frame reballing platform Precise positioning for the motherboard in high precision, strong magnetic pressing with no bulge Phone *3/*3Pro /*3Pro Max /*3Mini.

User's Guide Shows:
Step 1: Install the motherboard. Put the lower layer of motherboard that needs reballing to the corresponding positioning pins. Place it in the synthetic stone base.
Step 2: Install stencils
Align the stencils of the corresponding model with the positioning pins and put it into the base.
Step 3: Apply solder paste Apply the solder paste at the corresponding temperature to the reballing hole, make sure that each hole is covered with solder paste.
Step 4: Heat evenly Combine the top cover of the product with the base and operate. Use the hot air gun to heat the corresponding reballing hole.