FOB Price
Get Latest Price19.95 ~ 19.99 USD / Piece
|1 Piece Minimum Order
Country:
China
Model No:
FX533N
FOB Price:
19.95 ~ 19.99 USD / Piece Get Latest Price
Place of Origin:
China
Price for Minimum Order:
19.95 per Piece
Minimum Order Quantity:
1 Piece
Packaging Detail:
carton
Delivery Time:
5days
Supplying Ability:
100000000 Piece per Day
Payment Type:
T/T, L/C, D/A, D/P, Western Union, Money Gram, PayPal
Product Group :
Contact Person phonefixNicole
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QianLi ToolPlus iP**1 iP**2 Middle layer frame BGA reballing
stencil platform for Phone X XS XS MAX 1 Pro MAX motherboard
repair, ToolPlus iP**1 iP**2 Phone middle layer planting tin
soldering fixture, Qianli 3D BGA reballing metal stencil
motherboard middle frame planting tin reballing platform for Phone
logic board repair net fixture
Features :
Durable, unique design
Seiko, featured material
Precise positioning
Efficiency Improvement
Strong magnetic attraction
Stencils won't deform under high temperature
High quality Phone Middle Frame Reballing Platform
BGA Reballing Platform for Phone X/XS/XS MAX/*1/*1 Pro/*1 Pro
MAX.
Make your repair work easier
| Country: | China |
| Model No: | FX533N |
| FOB Price: | 19.95 ~ 19.99 / Piece Get Latest Price |
| Place of Origin: | China |
| Price for Minimum Order: | 19.95 per Piece |
| Minimum Order Quantity: | 1 Piece |
| Packaging Detail: | carton |
| Delivery Time: | 5days |
| Supplying Ability: | 100000000 Piece per Day |
| Payment Type: | T/T, L/C, D/A, D/P, Western Union, Money Gram, PayPal |
| Product Group : | soldering tools |
