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Silicon Wafer Polishing Slurry
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Silicon Wafer Polishing Slurry

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Country:

China

Model No:

FAO/S8010, FAO/S8015, FAO/S8025,

FOB Price:

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Place of Origin:

China

Price for Minimum Order:

-

Minimum Order Quantity:

-

Packaging Detail:

-

Delivery Time:

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Supplying Ability:

-

Payment Type:

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Contact Person Ms. Ellen

No.2-B Zhongxiao Park of Microelectronics Industrial Zone, Tianjin, Tianjin

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Product Specification

Product Description

Main characteristic : The abrasive of this product is blue ribbon nano SiO2 hydrosol, with characteristics of little pollution, easily washed, high polishing rate, small damage layer, and high flatness. The ratio can be optimized according to requirement. Compared with United States NALCO and Japan GLANZOX, the virtues of the product are high concentration, small abrasive size, small surface strain, easily washed for organic, metal ion and particle, high polishing speed (0.8~1.5μm/min), no uniform etch pit. Application: The product is mainly used in high quality polishing of multiple pervasion silicon. It also can be used to polish germanium, quartz, silicon oxide, sapphire and diffusion slices.

Country: China
Model No: FAO/S8010, FAO/S8015, FAO/S8025,
FOB Price: Get Latest Price
Place of Origin: China
Price for Minimum Order: -
Minimum Order Quantity: -
Packaging Detail: -
Delivery Time: -
Supplying Ability: -
Payment Type: -
Product Group : microelectronic

Related Products Jingling Electronic Materials Technology Co., Ltd.

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Ms. Ellen < Jingling Electronic Materials Technology Co., Ltd. >

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