Thermal Conductive Double-Sided Tape

Product Description

1. Product name
Thermal Conductive Double-Sided Tape
2. Product model
Standard type (TCDT-100): Thermal conductivity 1.0 W/m·K
High Performance (TCDT-300): Thermal conductivity 3.0 W/m·K
Ultra-thin type (TCDT-050): thickness 0.05 mm, thermal conductivity 1.5 W/m·K
3. Product Specifications
(1) Basic parameters
Material Structure :
Substrate: Fiberglass/Polyimide (PI)
Adhesive line: Silicone/acrylic (high viscosity thermal conductive filler)
Thickness: 0.05mm~0.5mm (optional)
Width: 5mm~500mm (support slitting customization)
Length: 5m/10m/50m (roll or die-sliced)
(2) Performance parameters
Model Thermal conductivity (W/m·K) Temperature resistance Breakdown voltage Adhesion (N/cm²)
TCDT-100 1.0 -40℃~150℃ >3kV 3~5
TCDT-300 3.0 -50℃~200℃ >5kV 6~10
TCDT-050 1.5 -30℃~120℃ >2kV 2~4
4. Core features
🔥 Efficient Thermal Conduction: Filled with metal oxide/ceramic particles, fast conduction of chip/heat sink heat.
🔌 Insulation and anti-short circuit: The breakdown voltage is up to 5kV to ensure the safety of electronic components.
🔄 Shock absorption and cushioning: The flexible substrate absorbs mechanical stress and protects precision devices.
⚡ Stick-and-use: Tear-off design, no need to apply thermal grease, simplifying the assembly process.
5. Typical Applications
Electronic Cooling :
LED strip/COB package
Power module/IGBT heat dissipation
The CPU of the mobile phone/tablet is bonded to the heat sink
New Energy :
The power battery module is fixed
Photovoltaic inverter components conduct heat
Industrial Equipment :
The motor controller dissipates heat
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