Please enter full name.
Please enter product name.
Select Industry.
Email address already exists
Please enter Password.
Enter Conatct number.
Please enter company name.
Please enter date.
Enter Message
By Signing Up. I agree to TradeKey.com Terms of Use, Privacy Policy, IPR and receive emails related to our services
Thank you, your message has been sent.
Invalid Email.
Nanshan,Shenzhen,Guangdong,China China
Contact Person Ms. Angela You
Address Nanshan, Shenzhen, Guangdong
minimum space size: 0.5mm ROHS complaint No. of IC: 47 pcs Soldering components: 1080pcs Minimum compo
Technical requirement: Layers: two Material: FR-4 Thickness: 1.6mm Surface processing: HAL
Layer: 4 layer Soldermask: green Thcikness: 1.6 mm Copper size: 1 oz surface finish: OSP Min. hole si
layer:Rigid 8Layers, Flexible 4Layers material:PI+FR4 Board thickness: Rigid 1.0mm, Flexible 0
layer:14 material:FR4 tg170 Board thickness: 5.0mm Surface finish:immersion g
layer:2 material:PI Board thickness: 0.25mm Surface finish:immersion gold Min
Technical description: layer:14 material:FR4 tg170 Board thickness: 5.0mm Surface finish&i
Technical description: layer:12 material:FR4 Board thickness: 1.6mm Surface finishï&fra
Technical description: layer:6 material:FR4 Board thickness: 1.0mm Surface finishï&frac
Technical description: minimum space size: 0.5mm ROHS complaint No. of IC: 47 pcs Soldering components:
Technical description: layer:1 material:PI Board thickness: 0.13mm Surface finishï&frac
We will contact you soon .
Please select at least one Buyer/Supplier.
Please enter name.
Please select industry.
Enter Password
Please select country.
Please select state.
Please select city.
Please Enter Message.
Enter Verification Code.