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Junrensi Electronic Technology

Dabandi road,Dongguan,Guangdong,China China

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Home Company Junrensi Electronic Technology Products

Contact Person James Zhao

Address Dabandi road, Dongguan, Guangdong

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Products: 3

eMMC test socket, size 11.5x13_0.5mm,Clamshell structure, for BGA 153 and BGA
EMMC test socket, size 11.5x13_0.5mm,Clamshell structure, for BGA 153 and BGA

Material and Finish 1.Socket lid:PEI; 2.Socket Base:PEI; 3.Contacts:BeCu, Selevitve Au-Au Flash over Ni Plating; 4.Springs:Stainless Steel, Passivated

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eMCP test socket, size:12*16,Clamshell structure, for BGA 153 and BGA
EMCP test socket, size:12*16,Clamshell structure, for BGA 153 and BGA

Material and Finish 1.Socket lid:PEI; 2.Socket Base:PEI; 3.Contacts:BeCu, Selevitve Au-Au Flash over Ni Plating; 4.Springs:Stainless Steel, Passivated

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silicon padding
Silicon padding

It is made of silicon which is wide used to make your a quiet home with this small dot, which is 1/2 inch, could used as different kind of buffer of n

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